Silicon Carbide
CAPA-RBSiC | CAPA-SSiC | ||||
UNITS |
REACTION BONDED SILICON CARBIDE |
SINTERED SILICON CARBIDE | |||
Density | G/CM3 | 3.2 | 3.2 | ||
Water Absorption | 0 | 0 | |||
Color | BLACK | BLACK | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 22 | 23 | |
Flexural Strength | MOR(20℃) | MPa | 450 | 540 | |
Compressive Strength | MPa | - | - | ||
Young's Modulus of Elasticity | GPa | 430 | 440 | ||
Possion Ratio | - | 0.16 | 0.17 | ||
Fracture Toughness | Mpa・m1/2 | 4 - 5 | 4 - 5 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 3.7 - 4.4 | 3.7 - 4.4 |
Thermal Conductivity | 20℃ | W/(m.K) | 60 | 140 | |
Specific Heat | J/(g.K) | 0.67 | 0.67 | ||
Heat Shock Resistance(Put in water) | ℃ | - | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | - | - | |
Volume Resistivity | 20℃ | Ω.cm | - | 105 | |
300℃ | - | 104 | |||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-Y-ZrO | ||||
UNITS | YTTRIA-STABLIZED ZIRCONIA | |||
Density | G/CM3 | 6 | ||
Water Absorption | 0 | |||
Color | White | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 12.7 | |
Flexural Strength | MOR(20℃) | MPa | 1000 | |
Compressive Strength | MPa | 5000 | ||
Young's Modulus of Elasticity | GPa | 220 | ||
Possion Ratio | - | 0.31 | ||
Fracture Toughness | Mpa・m1/2 | 4 - 5 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 11.0 |
Thermal Conductivity | 20℃ | W/(m.K) | 3 | |
Specific Heat | J/(g.K) | 0.46 | ||
Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | 11.0 | |
Volume Resistivity | 20℃ | Ω.cm | 1013 | |
300℃ | 106 | |||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-Mg-ZrO | ||||
UNITS | MAGNESIUM-STABLIZED ZIRCONIA | |||
Density | G/CM3 | 5.8 | ||
Water Absorption | 0 | |||
Color | Beige | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 12.0 | |
Flexural Strength | MOR(20℃) | MPa | 545 | |
Compressive Strength | MPa | 2400 | ||
Young's Modulus of Elasticity | GPa |
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Possion Ratio | - |
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Fracture Toughness | Mpa・m1/2 | 6.0 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6/℃ | 10.2 |
Thermal Conductivity | 20℃ | W/(m.K) | 2.2 | |
Specific Heat | J/(g.K) |
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Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm |
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Volume Resistivity | 20℃ | Ω.cm | 1014 | |
300℃ |
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*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-SSiC | ||||
UNITS | SILICON CARBIDE SSIC | |||
Density | G/CM3 | 3.2 | ||
Water Absorption | 0 | |||
Color | Black | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 23 | |
Flexural Strength | MOR(20℃) | MPa | 540 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 440 | ||
Possion Ratio | - | 0.17 | ||
Fracture Toughness | Mpa・m1/2 | 4 - 5 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 3.7 - 4.4 |
Thermal Conductivity | 20℃ | W/(m.K) | 60 | |
Specific Heat | J/(g.K) | 0.67 | ||
Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | - | |
Volume Resistivity | 20℃ | Ω.cm | 105 | |
300℃ | 104 | |||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-RBSiC | ||||
UNITS | REACTION BONDED SILICON CARBIDE | |||
Density | G/CM3 | 3.2 | ||
Water Absorption | 0 | |||
Color | Black | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 22 | |
Flexural Strength | MOR(20℃) | MPa | 450 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 430 | ||
Possion Ratio | - | 0.16 | ||
Fracture Toughness | Mpa・m1/2 | 4 - 5 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 3.7 - 4.4 |
Thermal Conductivity | 20℃ | W/(m.K) | 60 | |
Specific Heat | J/(g.K) | 0.67 | ||
Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | - | |
Volume Resistivity | 20℃ | Ω.cm | ||
300℃ | ||||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-SIN | ||||
UNITS | SILICON NITRIDE | |||
Density | G/CM3 | 3.2 | ||
Water Absorption | 0 | |||
Color | Black | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 13.9 | |
Flexural Strength | MOR(20℃) | MPa | 580 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 290 | ||
Possion Ratio | - | 0.28 | ||
Fracture Toughness | Mpa・m1/2 | 4 - 5 | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 2.4 - 3.2 |
Thermal Conductivity | 20℃ | W/(m.K) | 25 | |
Specific Heat | J/(g.K) | 0.64 | ||
Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | 12 | |
Volume Resistivity | 20℃ | Ω.cm | >1014 | |
300℃ | 1012 | |||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-AlN | ||||
UNITS | SILICON NITRIDE | |||
Density | G/CM3 | 3.2 | ||
Water Absorption | 0 | |||
Color | Gray | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 10.4 | |
Flexural Strength | MOR(20℃) | MPa | 350 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 310 | ||
Possion Ratio | - | 0.24 | ||
Fracture Toughness | Mpa・m1/2 | - | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 4.6 |
Thermal Conductivity | 20℃ | W/(m.K) | 140 | |
Specific Heat | J/(g.K) | 0.738 | ||
Heat Shock Resistance(Put in water) | ℃ | - | ||
Electrical Characteristics | Dielectric Strength | kV/mm | 25 | |
Volume Resistivity | 20℃ | Ω.cm | 1012 | |
300℃ | ||||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-STE | ||||
UNITS | STEATITE | |||
Density | G/CM3 | 2.8 | ||
Water Absorption | 0 | |||
Color | White | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | 5.8 | |
Flexural Strength | MOR(20℃) | MPa | 140 - 160 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 120 | ||
Possion Ratio | - | 0.22 | ||
Fracture Toughness | Mpa・m1/2 | - | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | 7.7 - 10.0 |
Thermal Conductivity | 20℃ | W/(m.K) | 2.0 - 3.0 | |
Specific Heat | J/(g.K) | |||
Heat Shock Resistance(Put in water) | ℃ | 250 | ||
Electrical Characteristics | Dielectric Strength | kV/mm | ||
Volume Resistivity | 20℃ | Ω.cm | ||
300℃ | ||||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |
CAPA-CODI | ||||
UNITS | CORDIERITE | |||
Density | G/CM3 | 2.3 | ||
Water Absorption | 0 | |||
Color | Gray | |||
Main Characteristics |
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Mechanical Characteristics | Vicker Hardness (Load 500g) | GPa | - | |
Flexural Strength | MOR(20℃) | MPa | 30 | |
Compressive Strength | MPa | - | ||
Young's Modulus of Elasticity | GPa | 140 | ||
Possion Ratio | - | 0.31 | ||
Fracture Toughness | Mpa・m1/2 | - | ||
Thermal Characteristics | Coefficient of Linear Thermal Expansion | 40-800℃ | 1x10-6 /℃ | <0.2(22-23℃) |
Thermal Conductivity | 20℃ | W/(m.K) | 2.0 - 3.0 | |
Specific Heat | J/(g.K) | 0.71 | ||
Heat Shock Resistance(Put in water) | ℃ | 1000 | ||
Electrical Characteristics | Dielectric Strength | kV/mm | 19.1 | |
Volume Resistivity | 20℃ | Ω.cm | >1014 | |
300℃ | 1012 | |||
*The values are typical material properties and may vary according to products configuration and manufacturing process. |